Coto Technology has introduced the first four independent channel, form A, planar BGA reed relay. The B41 series is the latest offering in Coto's growing line of RF capable, reed relay products.
The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
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