A land grid array/ball grid array socket has been designed for high performance ASIC applications. The new socket has pressure mount contacts on the top and bottom to prevent overstress on the socket.

Semiconductor devices housed in BGAs and µBGAs having up to 2,500 pins and running at speeds well beyond today's fastest ICs can all be tested, debugged and programmed using a series of ...

TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.

Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...