TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

Apple’s semiconductor roadmap is poised for a major breakthrough in 2026 with the introduction of the A20 Pro chip.

Apple's foldable iPhone will share the same next-generation A20 Pro chip as the iPhone 18 Pro and iPhone 18 Pro Max models ...

Apple is anticipated to unveil its first foldable device, the iPhone Fold, alongside the iPhone 18 Pro and Pro Max this ...

Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.

According to a new report from Taiwan, the upcoming A20 chip will cost Apple a massive $280 per unit. This apparently accounts for a year-over-year increase of more than 80% over the A19 chip that ...

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TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...