As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

CNBC’s MacKenzie Sigalos reports from AWS re:Invent on how Amazon’s new Trainium chip, energy-efficient design, and full-stack AI strategy aim to cement AWS’s dominance as Microsoft and Google race to ...

Semiconductor stocks look poised for further gains as investment in artificial intelligence (AI) infrastructure accelerates.