ARM, Denali, Intel, Rambus, Samsung, and Synopsys team on specification to address development challenges for DDR-DRAM memory systems PALO ALTO, Calif. -- Sept. 6, 2006 -- Denali Software, Inc., today ...
SAN FRANCISCO — A DDR PHY Interface (DFI) specification, seeking to define a common interface between memory controller logic and the PHY interface, is set to be unveiled next week at an event hosted ...
1 st Feb 2021 – T2M-IP The global independent semiconductor IP Cores & Technology provider, is pleased to announce the immediate availability of advanced DDR memory subsystem IP Cores comprising of ...
SUNNYVALE, Calif., May 21, 2008 – Denali Software, Inc., today, as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the ...
DesignWare DDR IP Delivers High Performance Memory Interface for Compute-Intensive Artificial Intelligence Applications in Multiple Silicon Processes Including 7-nm ...
This article appeared in Microwaves & RF and has been published here with permission. Check out our DAC 2023 coverage. At DAC 2023, OPENEDGES Technology will be in Booth 1354 demonstrating a beta ...
Engineering techniques to reduce power consumption by lowering the supply voltage and slowing the clock speed have reached practical limits of the semiconductor technologies. Newer solutions, which ...
High-speed-digital serial I/O links and DDR memory interfaces are presenting significant measurement challenges as fourth-generation standards emerge. As signals travel at ever higher speeds over ...
Are wide bandgap lll-V power devices feasible? Applied’s Ben Lee considers the challenges, and potential rewards, of silicon carbide and gallium nitride. DVCon India chair Gaurav Jalan chats with ...
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