Mechanical design engineering includes the design of numerous things. Things that you use every day, from toys, home appliances, clocks, and watches to cars, elevators, hydraulic presses, turbines, ...

Intelligent technology is allowing organizations to move from episodic transformation to continuous evolution by shrinking the coordination and experimentation costs that once made change slow and ...

Nvidia, Qualcomm, and Altera among the first to trial EDA giant's AI chip design agent The idea of machines that can build even better machines sounds like sci-fi, but the concept is becoming a ...

The pace of product design, development, and manufacturing is accelerating like never before, and consumers are demanding more from their products. Many products, like coffee makers and even doorbells ...

A monthly overview of things you need to know as an architect or aspiring architect. Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with ...

Increasingly, the concept of social sustainability has become a central theme in contemporary architecture discussions as users' subjective and non-static needs become paramount in the design process.

Why does anything have to change? A manufacturing company’s most critical product decisions are made every day in design reviews. And if you assess the state of what a design review looks like today, ...

Argonne National Laboratory researchers uncovered and continue to explore new ways to advance a semiconductor chips design technique using artificial intelligence. They present several AI-based ...

With these three steps, you can scale the creativity and innovation of your design team to differentiate the user experience, says Mark Smith, an Experience Design Lead in Cognizant UK & Ireland.

Identify needs, which may include the learning context and audience. How do you get there? Start with writing goals and learning objectives, then focus on assessments, learning activities, and ...

Upcoming 14A and 10A process nodes will use high-NA EUV anamorphic scanners, which will require two stitched half-fields to achieve the equivalent wafer exposure area of previous-generation scanners, ...