Master Bond EP54TC—is engineered for critical thermal management applications, featuring the highest thermal conductivity.

Two component EP29LPSP epoxy withstands temperatures as low as 4°K (452°F). Additionally, it resists cryogenic shocks due to going from room temperature down to liquid-helium temperatures in 5 to 10 ...

Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, ...

To millions of consumers who purchase inkjet printers for their computers, the digital printing process may seem mundane. That is decidedly not the case for commercial printers who use wide-format ...

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