MATERIALS: Master Bond Inc’s Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is well-suited for potting, coating and sealing electronic assemblies and ...

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry. Master Bond’s wide ...

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. Forumlated to serve as a damming compound, the thixotropic paste material can also be utilized for bonding and sealing.

The epoxy has a forgiving cure ratio which can be varied for more rigidity or better impact resistance. EP21LV two-part epoxy conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, ...

The rigid, impact-resistant epoxy maintains dimensions over a wide temperature range. EP30R aramid-fiber-reinforced, two-part epoxy adhesive bonds metals, glass, ceramics, vulcanized rubbers and many ...

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic ...

Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity ...

Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ...

The Master Bond EP21TDC-4 is a room temperature curing two part epoxy system that features high peel strength. This highly flexible epoxy is intended for high performance bonding, sealing and coating ...

For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy has exceptional ...

The FL901S is a one component, silver conductive epoxy film and preform system made specifically to provide high performance bonding and sealing. This system cures very quickly at moderately elevated ...