System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

Owens Corning (Toledo, OH) has debuted a multi-end roving designed for epoxy sheet molding compound (SMC) systems in automotive applications. In combination with such systems, ME1510 glass ...

Epoxies to keep up with fast HP-RTM: This high-pressure RTM equipment in use at specialist vehicle manufacturer Penso Consulting Ltd. in the UK is molding parts with Cytec’s fast-cure epoxy, XMTM710.