The Cadence custom/analog and digital implementation and signoff tools have been validated by TSMC on high-performance reference designs in order to provide customers with the fastest path to design ...

The next frontier in the electronics industry is the FinFET, a new type of multi-gate 3D transistor that offers tremendous power and performance advantages compared to traditional, planar transistors.

At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel is expected to present papers on its efforts to develop gate-all-around transistors. One paper from Intel describes a more ...

A new technical paper titled “Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing” was published by researchers at TU Munich, University of Stuttgart and ...