Forming circuits involves the use of cylindrical pieces of semiconductor material. These cylinders are sliced into thin, circular pieces known as bare wafers. The bare wafers are then oxidized before ...
Acquisition integrates advanced "shift-left" Design for Test (DFT) functionality into Siemens' Xpedition and Valor portfolios ...
New sensor technology could produce annual water savings of up to 50 percent during the integrated circuit manufacturing process, researchers say. Water conservation in semiconductor facilities is ...
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