The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...

Merger of 3 High-Tech Companies with US Equity Backing Creates One-Stop-Shop for Specialist Interconnect Solutions & Electronics Manufacturing Services Lisconn’s value lies in delivering high ...

A special section aims to untangle AI’s major building blocks while providing a peek into this industry’s evolving design ...

More flexible systems naturally expose a wider range of configurations and performance profiles. For AI-native developers, ...

At the Optical Fiber Communications Conference (OFC) 2024, Intel gave us a particularly interesting glimpse at what could be the future of chip and interconnect design. The Optical Compute ...

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed the boundaries of system-on-chip (SoC) design. A game-changing new ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

A nonblocking interconnect architecture smoothes the bumpy ride taken by SoC integration and IP reuse while ushering in a new abstraction level. Intellectual property (ip), and its reuse, is expected ...

Electromigration (EM) remains a critical reliability challenge in modern microelectronic systems, particularly as device miniaturisation and increased current densities intensify the phenomenon. In ...

Apple has taken what appears to be a logical approach to its Apple silicon releases. First, it will disperse onto its hardware the more basic iterations, such as the M3 Pro, and M3 Max. Next, it will ...

As systems-on-a-chip (SoCs) bring more functionality onto the chip itself, data flow becomes a daunting issue. To confront this design problem, Sonics, Inc. has come out with the SonicsMX solution.