Once the hotbed of chip development and manufacturing, Japan has been surpassed by the likes of Taiwan, South Korea, and the US. In a move to bring it back to the forefront of semiconductors, a new ...
Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...
Intel has released details on a new interconnect approach that it's using for future FPGAs, and could make available in CPUs as well, if demand is significant. Share on Facebook (opens in a new window ...
The Xilinx Virtex-7 2000T field-programmable gate array is the world’s highest-capacity programmable logic device. It has 6.8 billion transistors and 2 million logic cells equivalent to 20 million ...
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