KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.
The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
The growth of large area graphene films with a precisely controlled numbers of layers and stacking orders can open new possibilities in electronics and photonics but remains a challenge. This study ...
As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...
A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...
Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...
Researchers of the Center for Multidimensional Carbon Materials (CMCM) within the Institute for Basic Science (IBS, South Korea) have reported in Nature Nanotechnology the fabrication and use of ...
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