TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Microsoft announced today a new security feature for the Windows operating system. Named "Hardware-enforced Stack Protection," this feature allows applications to use the local CPU hardware to protect ...

Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

Artificial Intelligence/Machine Learning (AI/ML) growth proceeds at a lightning pace. In the past eight years, AI training capabilities have jumped by a factor of 300,000 (10X annually), driving rapid ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...