TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Apple’s semiconductor roadmap is poised for a major breakthrough in 2026 with the introduction of the A20 Pro chip.

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

What does it take to put a smartphone in readiness for an AI-saturated world? For Apple’s future iPhone 18, the solution resides deep within the silicon in a processor that fuses the smallest ...

Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.