The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...