Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Infineon Technologies has developed a stacking technique for multichip modules that removes the need to use specialised pinouts on the stacked devices. The solid-liquid interdiffusion (Solid) ...
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
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