The MarketWatch News Department was not involved in the creation of this content. DELRAY BEACH, Fla., Jan. 21, 2025 /PRNewswire/ -- The report "Thermal Interface Materials Market by Material (Silicone ...
Autonomous vehicles redefine the car from a mechanically centered product into a fully integrated electronic system. As the number of core electronic components such as sensors, system-on-chips, and ...
Effective thermal management is critical in modern electronics for maintaining component performance, life-time, and reliability. While thermal grease, also referred to as thermal paste or thermal ...
The thermal management materials market is expanding due to increased electronics use, miniaturization, and EV adoption. Key ...
With the increasing waste heat production by today’s electronics in ever smaller spaces, drawing this heat away quickly enough to prevent thermal throttling or damage is a major concern. This is where ...
This thin, highly compressible thermal interface material is suited for filling air gaps between heat generating devices and heatsinks, heat spreaders, and metal chassis. Measuring 0.010" thick, the ...
For use where contamination concerns prohibit the use of silicone-based thermal pads, Keratherm U 90, a silicone-free thermal interface material, provides high levels of thermal conductivity. The ...
A Thermal Interface Material (TIM) is a material used to improve heat transfer between two surfaces, typically a heat source (such as a computer processor) and a heat sink (such as a metal heatsink or ...
Thermal interface materials enable machines to perform tasks with the help of concise automation equipment using an interface instead of levers and switches. These materials consist of liquid crystal ...
Dr Richard Collins, Principal Analyst at IDTechEx, has recently published the below article on the topic of thermal interface materials. We thought that this would be of interest to you. Sample pages ...
Mahwah, N.J. — MH&W International now supplies Keratherm 86/82, a high tensile strength, thermal interface material (TIM) that improves heat transfer from ICs and other components to heat sinks.