Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
UnitySC continues to innovate its inspection and metrology products to deliver solutions that address the most advanced needs across semiconductor manufacturing processes. GRENOBLE, France, July 9, ...
SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...
Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...
Other packaging houses such as SPIL, Amkor, UTAC, ACET and others are also on the point to announce the start of their own Fan-out wafer level packaging operations. Embedded die package technology to ...
Micron Technology Inc. today began offering samples of a SDRAM die in wafer-level chip-scale packaging (WLCSP). The packaging process makes Micron one of the only memory manufacturers capable of ...
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