Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

MELVILLE, N.Y., May 2, 2023 /PRNewswire/ -- Micross Components ("Micross"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, ...

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

[Willem Melching] owns a 2010 Volkswagen Golf – a very common vehicle in Europe – and noticed that whilst the electronic steering rack supports the usual Lane Keep Assist (LKAS) system, and would be ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...