TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
According to a new report from Taiwan, the upcoming A20 chip will cost Apple a massive $280 per unit. This apparently accounts for a year-over-year increase of more than 80% over the A19 chip that ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Apple's next iPhone 17 models are expected to be the last to feature a 3nm chip. This technology was first introduced with the iPhone 14 Pro, and Apple has been improving its manufacturing processes.
Energy/bit optimization approach for multi-chip systems with possibility of co-optimization with the routing resources defined by the signalling pitch. December 7th, 2022 - By: Fraunhofer IIS/EAS More ...
IoT: By offering modules rather than standalone chips, LTSCT aims to simplify product design for customers targeting both ...
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