Efinix high-performance Titanium field-programmable gate arrays (FPGAs) are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent edge devices to ...

More than ever, power integrity is vital in the successful creation of today's system-on-a-chip (SoC) designs. That's because e xcessive rail voltage drop ( IR drop) and ground bounce can create ...

The Power Integrity Advance module ensures correct behavior of power distribution systems embedded within CADSTAR 13.0 design flow. It conducts EMC analysis and ac and dc power integrity analysis to ...

Experts at the Table: Semiconductor Engineering sat down to discuss power integrity challenges and best practices in designs at 7nm and below, and in 2.5D and 3D-IC packages, with Chip Stratakos, ...

The CST PCB Studio power integrity solver is based on a special 3D FEM approach, that can calculate accurate impedance profiles within a full 3D simulation. The power integrity solver is integrated in ...

Believed to be the first electromigration/voltage drop (EM/IR) tool for both analogue and digital methodologies, mPower has been released by Siemens Digital Industries. The tool marks Siemens’ entry ...

For system-on-a-chip designs at 90 and 65 nm, dynamic noise greatly exacerbates the challenge of timing signoff. To accurately examine noise effects, designers need tools that provide an accurate ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

CAMPBELL, Calif.--(BUSINESS WIRE)--Sigrity, Inc., the market leader in signal and power integrity solutions, today announced that TSMC has included two additional Sigrity analysis products – XcitePI ...

The future of design is here, and artificial intelligence (AI) is rapidly becoming a powerful ally in the world of signal integrity. AI isn’t just about doing more with less; it’s about doing things ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...