The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
A new technical paper titled “Mechanically-flexible wafer-scale integrated-photonics fabrication platform” was published by researchers at MIT and New York Center for Research, Economic Advancement, ...
The U.S. Department of Commerce has awarded TI up to $1.6 billion in CHIPS Act funding to support three new 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to ...
At the IEEE International Electron Devices Meeting (IEDM 2025), imec has announced a breakthrough in semiconductor-based biosensing: the first wafer-scale fabrication of solid-state nanopores using ...
MEMC Electronic Materials Inc. today said it has moved its pilot line at its center of excellence over to a full-scale 300mm silicon manufacturing site. MEMC, based in St. Peters, Mo., also announced ...
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