Abstract: This paper presents the design, simulation, analysis and characterization of a heterogenous 3D integration approach for miniaturization of RF front-end modules. The 3D integrated stack ...
Abstract: After developing a 352 MHz 1600 W RF power amplifier with the ART2K0FE LDMOS transistor from Ampleon, the question was whether we could increase this power with the newer ART2K5TPU ...
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