LLC, positioned between external memory and internal subsystems, stores frequently accessed data close to compute resources.

AI infrastructure can't evolve as fast as model innovation. Memory architecture is one of the few levers capable of accelerating deployment cycles. Enter SOCAMM2 ...

WCET analysis is essential for proving multicore real-time systems meet safety-critical deadlines under all operating ...

The new chips mark a turning point for Intel's strategy in cloud and telecommunications workloads, where efficiency and ...

Micron has unveiled the world's first high-capacity 256GB LPDRAM SOCAMM2 module, a design custom-built for data centers and ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

Processor is one of roughly half a dozen designs based on Broadcom's XDSiP platform Fujitsu’s 144-core Monaka CPU will be built using 3D-chip stacking tech from Broadcom, the merchant silicon slinger ...

Micron has announced it is shipping customer samples of a 256GB SOCAMM2 module built around low-power DRAM for data center platforms. The module targets a growing pain point in modern server design: ...

It has taken three decades for HPC to move to the cloud, and the truth is that a lot of simulation and modeling applications are still coded to run on ...

News highlights: 1/3 the power consumption and 1/3 smaller footprint versus standard RDIMMs — enabled by the industry's first monolithic 32Gb ...

The news surrounding the launch of Apple’s latest M5 Pro and M5 Max chips is full of the usual levels of Steve Jobs–esque ...

AMD has expanded its Socket AM5 desktop lineup with the Ryzen AI 400G series, based on the 4 nm “Gorgon Point” APU silicon. This marks AMD’s second desktop APU generation for AM5 after the Ryzen 8000G ...