TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
The big drivers of 5G mobile network adoption are higher bandwidth, lower latency and higher reliability. For 5G chipmakers, this translates into a need for 5G chips and modules with higher efficiency ...
Here are our picks for the top 10 edge AI chips with a bright future across applications from vision processing to handling multimodal LLMs.
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Agentic AI is driving a major transformation in computing, enabled by more powerful processors and new semiconductor manufacturing techniques. Traditional single-chip architectures are reticle-limited ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
Vicor Corp. announced the newest entries in its portfolio of isolated bus converter modules (BCMs®) based on the company's Converter housed in Package (ChiP) power component platform. Supplying up to ...
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