Abstract: Three-dimensional integrated circuits (3-D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased ...
Fremont, California-based embedUR with major Chennai operations launched ModelNova—a platform packed with over 150 lightweight AI models for gadgets like wearables, smart cameras, sensors, and robots.
Abstract: The pursuit of higher temperatures, frequencies, and power densities in power converters has significantly elevated the performance demands on power modules. Existing designs struggle to ...
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