Abstract: Laser Doppler Vibrometers (LDVs) are the most common optical characterization equipment for CMUTs since LDVs characterize both static and dynamic CMUTs in terms of static deflection and ...
Abstract: In a chiplet design, several dies are integrated through die-to-die interconnects. Technical challenges still exist when it comes to the repair of faulty die-to-die interconnects to boost ...
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