Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

MELVILLE, N.Y., May 2, 2023 /PRNewswire/ -- Micross Components ("Micross"), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, ...

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

[Willem Melching] owns a 2010 Volkswagen Golf – a very common vehicle in Europe – and noticed that whilst the electronic steering rack supports the usual Lane Keep Assist (LKAS) system, and would be ...

Chip and substrate fabrication might not be the most exciting topic in the world, but when it could lead to significant performance and efficiency improvements, you'd better bet I'm here for it. So, I ...

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address ...